Specific industry sectors like healthcare, automotive, and aerospace also benefit from Ansys digital engineering workflows in 2023 R2. New, integrated features in 2023 R2 enable engineers to efficiently meet high-tech challenges amid increasingly complex product requirements. Additionally, Ansys EMC Plus (formerly Ansys EMA3D Cable) now offers a full electromagnetic compatibility (EMC) workflow. A complete EM simulation and modeling chain for IC design integrates the Ansys High Frequency Structure Simulator ( HFSS), Ansys Q3D Extractor parasitic extraction analysis, and the Ansys RaptorX EM solver.

The latest updates to Ansys RedHawk-SC, a multiphysics sign-off solution for semiconductors, significantly accelerate thermal analysis workflows.

All major semiconductor foundries have certified Ansys solutions for their most advanced technology nodes, and Ansys electrothermal solutions are essential to reliable 3D-IC design. Innovations like high-density 3D-ICs enable product development teams to pack more features in a smaller space, but those compact form factors complicate thermal, electromagnetic (EM), and power challenges. These products depend on new semiconductor and integrated circuit (IC) technologies and advanced electronic capabilities. Industries Innovate and Collaborate with Digital EngineeringĪdvanced electronics are critical to next-gen product designs like electric vehicles (EVs), vertical takeoff and landing aircraft, and life-saving medical devices. “Virtual design and development is at the forefront of transformational innovation within leading organizations across industries, and we are helping to make this a reality.” “From semiconductor manufacturers to electric vehicle makers and autonomous aircraft developers, our latest software release empowers these organizations with scalable digital engineering workflows that are critical to digital transformation,” said Shane Emswiler, senior vice president of products at Ansys. In Ansys 2023 R2, a full EV power electronics electrothermal workflow provides solutions from power IC, to package, to board with Ansys SIwave-CPA and Ansys Q3D Extractor (pictured). It combines an exceptional range of enhanced numerics capabilities, performance improvements, and cross-disciplinary engineering solutions to equip organizations with advanced physics solvers, scalable GPU-based computing, and seamless workflows. PITTSBURGH, JThe latest release from Ansys, 2023 R2 enables distributed engineering teams with new technologies and improved performance to drive industry innovation forward.

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